Wafer, die & panel inspection
Semiconductor & LCD inspection
A missed particle at dicing becomes scrap after packaging when the part is worth several times more. We inspect every wafer, die and panel, not just a sample.
Semiconductor & LCD
A missed particle at dicing becomes scrap after packaging when the part is worth several times more. We inspect every wafer, die and panel, not just a sample.
- Defect detection of particles, residues and patterns
- Die chipping, micro crack & bump check
- Mura, bright/dark pixel & polariser defects
CellHigh-magnification telecentric · coaxial + dark-field · vibration-isolated · cleanroom-rated enclosure
Where the money is
Manual review of selected wafers and panels
Every wafer, die and panel, at speed
Pays back through: yield loss carried forward into packaging and assembly.
Your rupee figure is modelled from your own scrap, rework and warranty numbers during Assess & Feasibility.
| Wafer / Panel | Inspection result | Severity |
|---|---|---|
| W-2207-04 | Particle cluster | Critical |
| W-2207-09 | Micro-crack | Critical |
| D-4412 | Die chipping | Level 2 |
| LP-0881 | Mura (regional) | Level 2 |
| LP-0884 | Dead pixel cluster | Level 1 |
| W-2207-12 | Clean — pass | None |
Illustrative output. Detection performance is measured on your parts during feasibility.
Start here
Send us the component.
We will let you know if it is visible.
Send 30-50 samples of your good parts, your failure modes. We do imaging trials, train a model, and come back with what we measured, including the cases where the answer is no.